Contact Us
TEL: +86-755-29799869
E-mail:marketing@zdfcard.cn
Address: 5F, A Bldg., Hongwei Industrial Park, 70th area, Bao'an, Shenzhen, China
Home > Knowledge > Content
RFID Inlay for Contactless RFID Card Production
May 17, 2018

RFID Inlay for Contactless RFID Card Production

The detail working of RFID Inlay for contactless RFID card production

The procedure of  RFID Inlay Chip module punching, chip module implanting, ultrasonic wire embedding, thermo-compression chip welding as well as testing including bad unit marking.The RFID inlay testing process step is highly important for quality assurance. The integrated transponders in the RFID pre-laminated, collated, laminated or inlay sheets are tested, ensuring that the complete output is fully functional.

we produce and provide RFID inlay that have

1.multiple layouts available.

2.multiple chips available.

3.multiple chip combination available.

4.smooth surface and custom thickness.

5.quick turnaround and factory level prices

Specification:

material optionPVC, Transparent PVC, PET etc.
AntennaCopper Antenna
Chips AvailableLow frequency 125KHz chips, high frequency 13.56MHz chips, ultra-high frequency 860-960MHz chips, and hybrid chips.
Internal StructureCopper antenna welded to chip
Thickness0.38mm, 0.45mm, 0.5mm or custom thickness
Available Layouts2X5, 3X7, 3X8, 4X4, 4X5, 4X10, 5X5, 5X6, 5X10 and more


Picture showing:

F08 inlay (3).jpg